发明名称 Heat spreading device and method with sectioning forming multiple chambers
摘要 A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a first plurality of conduits, and a second at least two conduits. The second at least two conduits interconnect the first chamber portion and the second chamber portion. The heat spreading device may also include cavities, a barrier, and fins.
申请公布号 US9423192(B2) 申请公布日期 2016.08.23
申请号 US201113299431 申请日期 2011.11.18
申请人 Huawei Technologies Co., Ltd. 发明人 Tsoi Vadim;Henningsson Uno;Hong Yuping;Peng Feng;Yang Hua;Li Haipeng
分类号 F28F7/00;F24H9/02;F28F21/08;F28D15/02;H01L23/427 主分类号 F28F7/00
代理机构 Conley Rose, P.C. 代理人 Conley Rose, P.C. ;Rodolph Grant;Beaulieu Nicholas K.
主权项 1. A thermo siphon heat spreading device comprising: a first chamber portion formed within the thermo siphon heat spreading device; a second chamber portion formed within the thermo siphon heat spreading device; a first plurality of channels disposed within the first chamber portion, wherein all of the first plurality of channels are parallel to each other; a second plurality of channels disposed within the second chamber portion, wherein all of the second plurality of channels are parallel to each other, wherein the first chamber portion and the first plurality of channels form an evaporator, wherein the second chamber portion and the second plurality of channels form a condenser; and a sectioning structure that is configured to separate the first chamber portion from the second chamber portion such that fluid in a gas phase can be passed from the evaporator to the condenser through a riser which connects the evaporator and the condenser and fluid in a liquid phase can be passed from the condenser to the evaporator through a downcomer which connects the evaporator and the condenser, wherein the sectioning structure has a portion that forms the riser and is adjacent to and parallel to the second plurality of channels, wherein the sectioning structure has another portion that forms the downcomer and is adjacent to and parallel to the first plurality of channels, wherein the riser is the only riser in the thermo siphon heat spreading device, and wherein the downcomer is the only downcomer in the thermo siphon heat spreading device.
地址 Shenzhen CN