Electronic component packaging assembly.

摘要

A electronic component packaging assembly with high thermal transfer rates includes a molded plastic cover 100 that receives spring washers 106, ceramic pads 108, resistive elements 110 or other electronic components, and a ceramic base 116. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base provides effective thermal transfer from the packaging assembly to adjacent heat exchange surfaces and electrical isolation for the device providing a high degree of safety. When NiChrome resistive elements are used, the packaging assembly has the ability to dissipate high peak power surges without degradation and without unwanted heat buildup.