摘要 |
A cooling apparatus is disclosed that has a first cooling structure (220), in thermal contact with a heat source (210) having a temperature greater than a cool structure (250), comprising a channel through which a cooling fluid is passed, an isolator (230) between the heat source and the cool structure, the isolator in thermal contact with the first cooling structure and comprising a material of low thermal conductivity, and a second cooling (240) structure between the isolator and the cool structure, the second cooling structure comprising a channel through which cooling fluid is passed. |
申请人 |
ASML NETHERLANDS B.V.;HOL, SVEN ANTOIN JOHAN;DE KLERK, ANGELO CESAR PETER;LOOPSTRA, ERIK, ROELOF;JACOBS, FRANSICUS MATHIJS;SCHOLTEN, MARK |
发明人 |
HOL, SVEN ANTOIN JOHAN;DE KLERK, ANGELO CESAR PETER;LOOPSTRA, ERIK, ROELOF;JACOBS, FRANSICUS MATHIJS;SCHOLTEN, MARK |