Method for manufacturing light emitting device package

摘要

A method for manufacturing a light emitting device package is provided. In the method, a growth substrate including a plurality of light emitting devices disposed on a top surface of the growth substrate is prepared. A first package substrate having a bonding pattern corresponding to a portion of the plurality of light emitting devices is prepared, and the bonding pattern is disposed on a top surface of the first package substrate. The portion of the plurality of light emitting devices and the bonding pattern are bonded by disposing the top surface of the growth substrate to face the top surface of the first package substrate. The portion of the plurality of light emitting devices is separated from the growth substrate. The portion of the plurality of light emitting devices joined to the bonding pattern is packaged.

主权项

1. A method of manufacturing a light emitting device package, comprising:
preparing a growth substrate comprising a plurality of light emitting devices disposed on a top surface of the growth substrate; preparing a first package substrate having a plurality of bonding patterns corresponding to some light emitting devices from among the plurality of light emitting devices, the bonding patterns being disposed on a top surface of the first package substrate, and each bonding pattern includes a first conductive region and a second conductive region spaced apart from the first conductive region; bonding said some light emitting devices from among the plurality of light emitting devices and the bonding patterns by disposing the top surface of the growth substrate to face the top surface of the first package substrate so that each light emitting device overlaps and is in direct contact with the first conductive region and second conductive region of the corresponding bonding pattern; separating said some light emitting devices from among the plurality of light emitting devices from the growth substrate; and packaging said some light emitting devices from among the plurality of light emitting devices joined to the bonding patterns.