| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same with which it is possible to have an SOI wafer stuck to and released from an electrostatic chuck provided in a semiconductor manufacturing apparatus without causing a problem.SOLUTION: On an insulating film CL constituting an SOI wafer, a rectangular optical waveguide PO consisting of a semiconductor layer SL, an optical phase shifter PS, and an optical modulator PC are formed, and then a back insulating film formed on the back of the SOI wafer is removed. Furthermore, a plurality of grooves TR having a first depth from the top face of the insulating film CL are formed on the insulating film CL at a position that does not overlap, in a plan view, the rectangular optical waveguide PO, the optical phase shifter PS, and the optical modulator PC. Thus, even when the SOI wafer is mounted in an electrostatic chuck provided in a semiconductor manufacturing apparatus, it is made easy for electric charges to flow away from the SOI wafer, making it less liable for electric charges to accumulate on the back of the SOI wafer.SELECTED DRAWING: Figure 1 |
