| 发明名称 |
Method of reducing a sheet resistance in an electronic device, and an electronic device |
| 摘要 |
Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance. |
| 申请公布号 |
US2016336226(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201615151857 |
申请日期 |
2016.05.11 |
| 申请人 |
Infineon Technologies AG |
发明人 |
FUERGUT Edward;ESCHER-POEPPEL Irmgard;FASSL Stephanie;GANITZER Paul;POEPPEL Gerhard;SCHUSTEREDER Werner;WIEDENHOFER Harald |
| 分类号 |
H01L21/768;H01L21/324;H01L21/321;H01L21/268;H01L23/528;H01L23/31 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of reducing a sheet resistance in an electronic device, the method comprising:
providing an electronic device comprising a multilayer structure; and locally introducing energy into the multilayer structure for reducing a sheet resistance. |
| 地址 |
Neubiberg DE |
