发明名称 |
Method of forming pattern |
摘要 |
According to one embodiment, a method of forming a pattern includes applying a polymer material having a first segment and a second segment in openings formed in a guide, heating the polymer material to achieve microphase separation of the polymer material to form a self-assembled pattern which includes a first polymer portion having a cylindrical shape which includes the first segment, and a second polymer portion including the second segment and surrounding a lateral portion of the first polymer portion, and selectively removing the first polymer portion. A molecular weight ratio of the first segment to the second segment in the polymer material is approximately 4:6. |
申请公布号 |
US9514938(B2) |
申请公布日期 |
2016.12.06 |
申请号 |
US201414181303 |
申请日期 |
2014.02.14 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
Sato Hironobu |
分类号 |
B29C35/00;H01L21/027;G03F7/00;H01L21/033;B81C1/00 |
主分类号 |
B29C35/00 |
代理机构 |
Patterson & Sheridan, LLP |
代理人 |
Patterson & Sheridan, LLP |
主权项 |
1. A method of forming a pattern, comprising:
forming a pattern having an opening on a film to be processed; depositing a polymer material having a first polymer segment and a second polymer segment in the opening; heating the polymer material to achieve microphase separation of the polymer material into a first polymer phase portion including the first polymer segment, and a second polymer phase portion including the second polymer segment, the first polymer phase portion including an upper portion having a rectangular plate shape with rounded corners and a plurality of lower portions each of which extends from the upper portion as a cylindrical shape, and the second polymer phase portion surrounding the first polymer phase portion; and selectively removing the first polymer phase portion, wherein molecular weights of the first polymer segment and the second polymer segment satisfy the following formula:
37/63≦(the molecular weight of the first polymer segment)/(the molecular weight of the second polymer segment)≦42/58. |
地址 |
Tokyo JP |