| 摘要 |
PROBLEM TO BE SOLVED: To prevent poor bonding of a package to a printed circuit board, before a semiconductor chip package is pre-bonded to a printed circuit board, by removing mold release agents and contaminants with electric, chemical, or thermal energy. SOLUTION: A silicon wafer provided with a fine circuit pattern of specified shape is cut, so that plural separate chips are prepared. With a bonding agent, a chip is attached to a die pad of a lead frame. On a cavity of a prepared semiconductor chip package, electric, chemical, or thermal energy is applied for surface process, so that mold release agents or contaminants are removed. A semiconductor chip package where surface process is completed is attached to a printed circuit board by a loading means. Then, external leads of the package are aligned on a land pattern, and bonding agents are cured, then the package is pre-bonded to the printed circuit board. |
