发明名称 ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
摘要 PROBLEM TO BE SOLVED: To stably form a plating film of fixed film quality at all times even if a polarization curve is changed owing to an initial surface state, the progression of plating or the like. SOLUTION: The electroplating device comprises: an anode 134; a reference electrode 140 formed on the surface of a substrate and composing a three electrode system with an electrically conductive layer to form into a cathode in the case of electroplating; and a potentiostat 144 of controlling the cathode potential of the electrically conductive layer with the potential of the reference electrode 140 as a reference. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006152421(A) 申请公布日期 2006.06.15
申请号 JP20040349068 申请日期 2004.12.01
申请人 EBARA CORP 发明人 SHIMOYAMA TADASHI
分类号 C25D17/10;C25D7/12;C25D17/00;C25D21/12 主分类号 C25D17/10
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