| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which has low resistance surface wiring layers and internal wiring layers which are formed by baking simultaneously with an insulating board made of aluminum oxide ceramics, contain copper and, further, without spreads of wirings. SOLUTION: The multilayer wiring board has a ceramic insulating board 1 and surface wiring layers 2a and internal wiring layers 2b which are formed on the surface and inside of the insulating board 1 by baking simultaneously with the insulating board 1. The surface wiring layer 2a contains 10-70 vol.% of copper and 30-90 vol.% of tungsten and/or molybdenum and the internal wiring layer 2b contains 20-80 vol.% of copper, and 20-80 vol.% of tungsten and/or molybdenum and, further, the copper content of the internal wiring layer 2b is larger than that of the surface wiring layer 2a. The sheet resistance of the surface wiring layer 2a is not larger than 8 mΩ/(square), and the sheet resistance of the internal wiring layer 2b is not larger than 6 mΩ/(square) and, further, it is desirable to have the sheet resistance of the surface layer not larger than 6 mΩ/(square) by applying a metal layer 4 to the surface of the surface wiring layer 2a by a plating method.</p> |
