发明名称 Flexible antenna and method of manufacture
摘要 A flexible microwave antenna having a “fish-scale” ground plane is provided. The approach represents a significant advance in the combined thickness and flexibility that can be achieved, especially when using relatively thick substrates which are important for optimum antenna performance. An increase in gain was observed when bent in a positive radius of curvature and further reduction of back radiation.
申请公布号 US9531077(B1) 申请公布日期 2016.12.27
申请号 US201514691201 申请日期 2015.04.20
申请人 University of South Florida;Raytheon Company;The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration 发明人 Weller Thomas;Cure David;Herzig Paul A.;Miranda Felix
分类号 H01Q1/38;H01Q9/16;H01Q9/04 主分类号 H01Q1/38
代理机构 Smith & Hopen, P.A. 代理人 Sauter Molly L.;Smith & Hopen, P.A.
主权项 1. An antenna assembly comprising: a first flexible substrate comprising a planar antenna fabricated on a first surface of the first flexible substrate; a first flexible dielectric substrate having a first surface bonded to a second surface of the first flexible substrate; a second flexible substrate comprising a frequency selective high impedance surface fabricated on a first surface of the second flexible substrate, the first surface of the second flexible substrate bonded to a second surface of the first flexible dielectric substrate; a second flexible dielectric substrate having a first surface bonded to a second surface of the second flexible substrate; and an overlapping conductor ground plane comprising a plurality of overlapping conductive plates and each of the plurality of overlapping conductive plates comprising a first portion bonded to the second surface of the second flexible dielectric substrate and a second portion not bonded to the second surface of the second flexible dielectric substrate, wherein the second portion of each of the plurality of overlapping conductive plates is positioned to overlap another of the plurality of conductive plates having a first portion bonded to the second surface of the second flexible dielectric substrate to form the overlapping conductor ground plane.
地址 Tampa FL US