INTEGRATED CIRCUIT PACKAGE AND ASSEMBLY THEREOF FOR THERMAL AND EMI MANAGEMENT

摘要

A package is provided for an integrated circuit comprising a combined heat dissipating and electromagnetic shielding structure. Conveniently, the heat dissipation and shielding structure is a laminated composite structure including layers of several materials having complementary characteristics to provide high magnetic permeability, electrical conductivity, and thermal conductivity. For example, a sandwich structure of layers of copper/Kovar TM/ copper is effective in dissipating heat and reducing electromagnetic emission from ASICs for telecommunications applications; each dissipating in excess of 2 Watts. Preferably a substrate of the package includes a conductive die attach pad which may be grounded to bring a ground plane close to the integrated circuit. The composite electromagnetic shielding and heat dissipation structure is grounded to improve attenuation of radiated electromagnetic emission from the chip. The electromagnetic shielding and heat dissipation structure is applicable for packages for individual IC chips and for multi-chip modules.