WIRE BONDING BGA PACKAGE

摘要

PURPOSE: A wire bonding BGA(Ball Grid Array) package is provided to improve a combination force of a solder by changing a structure of a wire bonding BGA package. CONSTITUTION: A semiconductor chip(210) has an active region(214) formed with bonding pads(212). An elastomer(230) is adhered on the remaining active region(214) except for the bonding pads(212). A polyimide film(220) is adhered on the elastomer(230). A metal line(240) of a predetermined pattern is formed on a bottom of the polyimide film(220). A window(222) and an opening(224) are formed on the polyimide film(220) in order to expose the metal line(240). A bonding wire(270) is used for connecting electrically the bonding pads(212) with an end portion of a corresponding metal line(240) through the window(222) of the polyimide film(220). A molding resin(250) is used for sealing the region connected with the bonding wire(270). An external connection terminal(260) is formed on one end portion of the metal line(240) exposed by the opening(224).