发明名称 PHOTOREACTIVE HOT MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photoreactive hot melt adhesive composition which can quickly be cured by the irradiation of active energy rays, express excellent heat resistance and an excellent adhesive strength to an adherent comprising a slightly adhesive plastic such as PET after cured, has excellent storage stability, and does not affect working environments. SOLUTION: This photoreactive hot melt adhesive composition is characterized by comprising a cation-polymerizable compound having one or more cation- polymerizable reactive groups represented by the general formula (1), [R1, R2, R3 and R4 are each H, methyl, ethyl, isopropyl, isoamyl or phenyl; (m) and (n) are each 0, 1 or 2] per molecule on an average, at least one metal ion source selected from the group consisting of metal salts, metal hydroxides and metal oxides, and a photocation polymerization initiator.
申请公布号 JP2002155258(A) 申请公布日期 2002.05.28
申请号 JP20000354611 申请日期 2000.11.21
申请人 SEKISUI CHEM CO LTD 发明人 SHINJO TAKASHI;HASEGAWA TAKESHI;MIYAKE TAKESHI
分类号 C09J163/00;C09J171/02;(IPC1-7):C09J163/00 主分类号 C09J163/00
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