发明名称 PACKAGED COOLING DEVICE AND METHOD FOR PACKAGING COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To eliminate some problems that an outer shape of a cooling device is increased after its packaging operation to prevent a load from being applied to the cooling device and the cooling device from being deformed when the cooling devices were to be stacked up with each other because each of the devices had an easy deformable outer surface or a projected pipe; and that a necessity of preparing packaging materials having a sufficient strength against a load increases its cost. SOLUTION: A cooling device with its easy-deformable surface being set at its side surface is held with a packaging material from its upper side to its lower side, and further its pipe segments are stored in the packaging materials to enable an outer shape of the refrigerator device after its packaging to be decreased. In addition, material quality of the packaging materials was inexpensive and its amount of use was decreased to reduce the packaging cost.
申请公布号 JP2002154593(A) 申请公布日期 2002.05.28
申请号 JP20000352920 申请日期 2000.11.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 HORIUCHI KATSUNORI;SUGIMOTO TAKESHI;SATO MINEO;KURACHI MITSUNORI
分类号 B65D85/68;F25D23/00;(IPC1-7):B65D85/68 主分类号 B65D85/68
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