| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a BGA semiconductor package preventing phenomena such as the fall of solder balls, pattern cracks, and the separation of solder ball lands by adopting a solder ball land structure with an SMD type and an NSMD type mixed, and having high reliability with the high fusing power of the solder balls to a substrate. <P>SOLUTION: A semiconductor package is provided with a substrate having a plane surface, a plurality of solder ball lands that are formed on the planar surface of the substrate, solder balls that are formed in a plurality of solder ball lands, and a mask layer which limits a plurality of opening regions which expose the solder ball lands and have radii smaller than that of the solder ball land and is applied over the planar surface of the substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
