| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in handleability, high in reactivity, excellent in flame retardancy and having added high heat resistance, a prepreg using the same, a resin film with a supporter, a metal foil-clad laminate and a multilayer wiring board.SOLUTION: The epoxy resin composition contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, the (A) phosphorus-containing curing agent is a phosphorus compound represented by the chemical formula (1), an organic group represented by R in the chemical formula (1) has two or more phenolic hydroxyl groups and molecular weight of the organic group is 190 or more.SELECTED DRAWING: None |
