| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition capable of fabricating a semiconductor device excellent in connection reliability, an adhesive sheet for connecting circuit members using the adhesive composition, and a manufacturing method of semiconductor device.SOLUTION: An adhesive composition contains (A) a thermosetting resin, (B) a hardener, and (C) a monocarboxylic acid, the monocarboxylic acid having a solubility parameter of 13.1 or less. The adhesive composition is used for sealing at least a part of connections of a semiconductor chip and a wiring circuit board in a semiconductor device, the connections being electrically connected to each other, respectively, or at least a part of connections of a plurality of semiconductor chips in a semiconductor device, the connections being electrically connected to each other, respectively.SELECTED DRAWING: Figure 1 |
