| 发明名称 |
Thermally enhanced interposer and method |
| 摘要 |
The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.
|
| 申请公布号 |
US6712621(B2) |
申请公布日期 |
2004.03.30 |
| 申请号 |
US20020055771 |
申请日期 |
2002.01.23 |
| 申请人 |
HIGH CONNECTION DENSITY, INC. |
发明人 |
LI CHE-YU;FAN ZHINENG;BROWN DIRK D. |
| 分类号 |
G06F1/18;H01L23/367;H01R12/04;H05K1/14;H05K1/18;H05K3/46;H05K7/10;H05K7/20;(IPC1-7):H01R12/00;H05R1/00 |
主分类号 |
G06F1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
