| 摘要 |
PURPOSE:To contribute to a reduction in thickness of an electronic component as a product, to shorten a time required up to completion of bonding, to reduce in cost of an entire apparatus and to improve its yield. CONSTITUTION:A semiconductor component (IC chip) 19 is so disposed as to be buried in an opening formed in a frame L/F to contribute to a reduction in thickness of the component as a product. Further, since the component is fixed to the frame via wires, etc., it is not necessary to have fixture of adhesive, a curing unit is eliminated, an operation is accelerated and a reduction in cost is obtained. Further, since the component is placed directly on a bonding stage, it is not inclined, bonding is effectively conducted, and high yield can be performed. |
