| 摘要 |
PURPOSE: To provide a technique with which ball bonding can be conducted accurately by a covered wire using bonding technique. CONSTITUTION: A covered wire 2, which is covered by an insulator, is wound on a spool 1, and a connection terminal, which is electrically connected to the start-of-winding end of the covered wire 2, is provided on the spool 1. A bonding tool 7, with which a metal wire is connected between the outer terminal of a semiconductor chip 12A and a lead 12D by drawing out the covered wire 2 from feeding side, is provided and an arc electrode 10, with which a ball is formed on the tip part on feeding side of the covered wire 2, is connected to an arc-generating circuit 11. The spool 1 is supported by a spool holder 8 in a freely rotatable manner, the spool holder 8 is electrically connected to a reference potential terminal, and the covered wire 2 is connected to the reference potential terminal through the connection terminal and the spool holder. |
