发明名称 POST-TREATMENT METHOD OF METAL PLATE
摘要 PROBLEM TO BE SOLVED: To provide a post-treatment method of a metal plate capable of preventing fluctuation in film quantity and degradation in productivity. SOLUTION: A metal plate is post-treated by adjusting the temperature of a treatment solution according to the line speed. The relationship between the treatment time (t), the treatment solution temperature T and the quantity of a film to be treated is obtained in advance. In changing the line speed, the treatment time t0 necessary for obtaining the reference quantity of the film at the reference treatment solution temperature T0 is compared with the maximum treatment time tm determined based on the line speed and the facility length of a post-treatment device. When the maximum treatment time tm is not less than the necessary treatment time t0 the treatment is achieved by adjusting the treatment time(t) so that the treatment time (t) becomes the necessary treatment time t0. When the maximum treatment time tm is smaller than the necessary treatment time t0, the treatment solution temperature Tm necessary for obtaining the reference film quantity at the maximum treatment time tm is obtained, and the treatment solution temperature T is adjusted so that the treatment solution temperature T becomes the treatment solution temperature Tm.
申请公布号 JP2000319789(A) 申请公布日期 2000.11.21
申请号 JP19990127316 申请日期 1999.05.07
申请人 NKK CORP 发明人 INOUE SHIGERU;OSAKI YASUNORI;IMOKAWA TORU
分类号 C23C22/82;C23C22/76;(IPC1-7):C23C22/82 主分类号 C23C22/82
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