| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which mounting area can be set nearly as equal as a chip and where a backside electrode provided to the chip can be led out keeping it low in resistance. <P>SOLUTION: A solder ball or the like is formed on the front surface of a semiconductor chip 11 to serve a first outer connection terminal 14. The semiconductor chip 11 is fixed on a substrate 16, and a second outer connection terminal 17 is formed on the substrate 16. The first outer connection terminal 14 and the second outer connection terminal 17 are nearly equal to each other in height. The first and second outer connection terminals 14, 17 are bonded in face to face with each other. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
