发明名称 |
Organic electronic device provided with a metallic heat sink structure |
摘要 |
An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
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申请公布号 |
US7358665(B2) |
申请公布日期 |
2008.04.15 |
申请号 |
US20040999821 |
申请日期 |
2004.11.30 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
YU GANG;WANG JIAN |
分类号 |
H05B33/00;H01L23/367;H01L23/495;H01L27/32;H01L33/64;H01L51/50;H01L51/52 |
主分类号 |
H05B33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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