INTEGRATED CIRCUIT (IC) PACKAGE WITH A SOLDER RECEIVING AREA AND ASSOCIATED METHODS

摘要

A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

主权项

1. An integrated circuit (IC) package comprising:
a die pad; a spacer ring on said die pad defining a solder receiving area, with said spacer ring comprising a material different than said die pad; a solder body on said die pad within the solder receiving area; an IC die on said spacer ring and secured to said die pad by said solder body within the solder receiving area; and encapsulating material surrounding said die pad, spacer ring, and IC die.