发明名称 |
CURABLE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a material excellent in adhesiveness to a substrate even under a cold condition and having flexibility of the resulting cured film.SOLUTION: There is provided a curable resin composition containing (A) a thioether-containing (meth)acrylate derivative with a special structure, (B) a polyfunctional epoxy resin having weight average molecular weight of 200 to 50000 and (C) an amine compound having weight average molecular weight of 90 to 700. A mass ratio of the (A) component and the (B) component ((A)/(B)) is 0.05 to 30 and the (C) component is blended at 0.01 to 50 pts.mass to 100 pts.mass of the total mass of the (A) component and the (B) component.SELECTED DRAWING: None |
申请公布号 |
JP2016138191(A) |
申请公布日期 |
2016.08.04 |
申请号 |
JP20150013903 |
申请日期 |
2015.01.28 |
申请人 |
NOF CORP |
发明人 |
KODA KAZUHIRO;TASHIRO HIROSHI;FUJIMURA TOSHINOBU |
分类号 |
C08G59/66;C08K5/103;C08K5/17;C08K5/37;C08L63/00 |
主分类号 |
C08G59/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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