Wiring substrate with filled vias to accommodate custom terminals

摘要

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

主权项

1. A probe card assembly comprising:
electrically conductive probes extending from a probe substrate and disposed to contact terminals of an electronic device to be tested; and a wiring substrate comprising an electrical interface to a tester for controlling testing of said electronic device, wherein said interface is electrically connected to said probes, and wherein said wiring substrate further comprising:
a first surface and an opposite surface;an electrically conductive first via comprising electrically conductive material extending into said wiring substrate from said opposite surface and ending before reaching said first surface;a plurality of electrically conductive second vias, wherein each of said second vias are electrically conductive from said first surface to said opposite surface; anda custom electrically conductive terminal disposed on said first surface such that said custom terminal covers and contacts said first via without electrically connecting to said first via and covers and contacts and electrically connects to one of said second vias that is adjacent to said first via.