PLATING APPARATUS FOR WAFER,申请号JP19970335103-传众专利搜索

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发明名称	PLATING APPARATUS FOR WAFER
摘要
申请公布号	JPH11152600(A)	申请公布日期	1999.06.08
申请号	JP19970335103	申请日期	1997.11.19
申请人	EBARA CORP	发明人	YOSHIOKA JUNICHIRO;SAITO NOBUTOSHI
分类号	C25D7/12;C25D17/10;H01L21/02;(IPC1-7):C25D17/10	主分类号	C25D7/12
代理机构		代理人
主权项
地址

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