发明名称 Light emitting diode package having heat dissipating slugs
摘要 A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
申请公布号 US9412924(B2) 申请公布日期 2016.08.09
申请号 US201414226025 申请日期 2014.03.26
申请人 Seoul Semiconductor Co., Ltd. 发明人 Seo Tae Won;Lee Sang Cheol;Jung Chan Sung
分类号 H01L33/64;H01L33/48;H01L33/60;H01L33/62 主分类号 H01L33/64
代理机构 H.C. Park & Associates, PLC 代理人 H.C. Park & Associates, PLC
主权项 1. A light emitting diode package, comprising: first and second conductive substrates completely spaced apart from each other; a light emitting diode die disposed on the first conductive substrate; and a main package body disposed on the first and second conductive substrates and surrounding the light emitting diode die, wherein each of the first and second conductive substrates comprises at least one fin.
地址 Ansan-si KR