发明名称 SEMICONDUCTOR LAMINATE, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF
摘要 Provided is a method for manufacturing a semiconductor device. Also provided are: a semiconductor device which can be obtained by the method; and a dispersion that can be used in the method. A method for manufacturing a semiconductor device (500a) of the present invention includes the steps (a)-(c) described below. (a) A dispersion which contains doped particles is applied to a specific part of a layer or a base. (b) An unsintered dopant implanted layer is obtained by drying the applied dispersion. (c) The specific part of the layer or the base is doped with a p-type or n-type dopant by irradiating the unsintered dopant implanted layer with light, and the unsintered dopant implanted layer is sintered, thereby obtaining a dopant implanted layer that is integrated with the layer or the base.
申请公布号 US2016300717(A1) 申请公布日期 2016.10.13
申请号 US201615097672 申请日期 2016.04.13
申请人 TEIJIN LIMITED 发明人 TOMIZAWA Yuka;IKEDA Yoshinori;Imamura Tetsuya
分类号 H01L21/02;H01L31/18;H01L29/66;H01L31/068 主分类号 H01L21/02
代理机构 代理人
主权项
地址 Osaka JP