CIRCUIT DEVICE WITH IMPROVED ADHESION BETWEEN CONDUCTIVE PATTERN AND INSULATING RESIN AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A circuit device and a manufacturing method thereof are provided to improve adhesion between a conductive pattern and insulating resin by forming a constricted portion at a side of a separation groove. CONSTITUTION: A circuit device includes a conductive pattern, a circuit part, and an insulating resin part. The conductive pattern(11) is separated by separation grooves(41). The circuit part(12) is fixed on the conductive pattern. The insulating resin part(13) is used for coating the circuit part and the conductive pattern. The separation grooves are filled with the insulating resin part. By forming a constricted portion at a side of each separation groove, the insulating resin part is strongly attached to the conductive pattern.