发明名称 |
Planarizing interposer for thermal compensation of a probe card |
摘要 |
A probe card assembly that compensates for differing rates of thermal expansion is disclosed herein. The assembly is comprised of a multi-layered dielectric plate interposed between a probe head and a printed circuit board. The printed circuit board has arrayed upon its surface a first plurality of electrical contacts arranged in a pattern. The dielectric plate has a second plurality of electrical contacts arranged in a pattern matching the first plurality of contacts. A planarizing interposer is interposed between the plate and the printed circuit board and has a pattern of holes matching the pattern of electrical contacts on the printed circuit board and plate. The assembly further includes a plurality of electrical connectors disposed within each of the holes arrayed in a pattern upon the planarizing interposer a plurality conductive bumps or fuzz buttons making electrical contact with the first and second plurality of electrical contacts.
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申请公布号 |
US6756797(B2) |
申请公布日期 |
2004.06.29 |
申请号 |
US20020059677 |
申请日期 |
2002.01.29 |
申请人 |
WENTWORTH LABORATORIES INC. |
发明人 |
BRANDORFF ALEXANDER;PARDEE WILLIAM P. |
分类号 |
G01R1/073;G01R31/28;G01R31/319;H01L21/66;(IPC1-7):G01R31/02 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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