| 摘要 |
<p>PURPOSE: To provide a semiconductor circuit device group which detects the contact condition of the outer connection pad with a probe at the time of performing the probe test. CONSTITUTION: An inner circuit 4 is provided at the center of a semiconductor circuit device 2, and signal pads 3 connected to the inner circuit 4 are provided at the periphery for the external connection. In the dicing area 5 formed at the outer circumference of the semiconductor circuit device 2, first and second monitor pads 14 and 13 for contact inspection are formed, and the first and second monitor pads 14 and 13 are connected to the same signal pad 3 through metal wiring. At the time of performing probe test, current is supplied between the signal pad 3 and the first monitor pad 14, a voltage between the signal pad 3 and the second monitor pad 13 is measured and a contact resistance between the probe and the signal pad 3 is obtained.</p> |
