METHOD FOR BRAZING BY SOLDER REFLOW ELECTRONIC COMPONENTS AND BRAZING DEVICE THEREFOR

摘要

The invention concerns a method for brazing by solder reflow electronic components (22) on a support, for example a printed circuit wafer (20) which consists in: arranging a solder alloy on the support (20) in sites for connecting the components (22); placing the components on the connection sites and brazing the components (22) properly speaking by a thermal treatment of the support, by contacting it, at a pressure close to atmospheric pressure, with a treating atmosphere comprising excited or unstable species substantially free from electrically charged species, the atmosphere being obtained by passing an initial treating gas in an electrical discharge, and the thermal treatment of the support being obtained by using the species thus heated by the action of the discharge.