| 摘要 |
A module retention adapter for attaching enabled heat sinks to the user target system while validating a processor with an LAI tool. In a preferred embodiment, the invention comprises an adapter and a clip. A user attaches an adapter to each retention module on a target system. Once a processor is loaded into the LAI tool and a heat sink solution is loaded onto the processor between the adapters. The heat sink clips are then clipped onto the adapters. The clips retain the heat sink to the adapters while also retaining the heat sink to the motherboard retention modules.
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