PRINTED CIRCUIT BOARD WITH ENHANCED RADIATING ABILITY

摘要

A printed circuit board having an enhanced radiation characteristic is provided to improve heat radiation from the printed circuit board by forming a circuit pattern using aluminum of which a thickness is adjusted relatively to a copper thin film. A printed circuit board having an enhanced radiation characteristic includes a core(100), and a signal transfer layer. The core includes a first internal layer circuit pattern and a second internal layer circuit pattern. The first internal layer circuit pattern is formed on a top of an internal insulation layer(102). The second internal circuit pattern having a different material from the first internal circuit pattern is formed on a bottom of the internal insulation layer. The signal transfer layer is electrically connected to the first internal layer circuit pattern and the second internal layer circuit pattern. The signal transfer layer is stacked on both sides of the core. The first internal layer circuit pattern is formed with a copper thin film. The second internal layer circuit pattern is formed with aluminum.