Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication

摘要

The various embodiments described herein provide microelectromechanical systems (MEMS) sensor devices and methods of forming the same. In general, the embodiments provide MEMS sensor devices formed with two semiconductor die that are bonded together. Specifically, a sensor die includes at least one MEMS sensor fabricated thereon, such as MEMS gyroscope or MEMS accelerometer. A control-circuit die includes at least one integrated MEMS control circuit formed on an active area of the die. The control-circuit die is bonded to the sensor die with the active area and the integrated MEMS control circuits on the exterior side. The bonding defines and seals a cavity between the two die that encompasses the MEMS sensor and can be used to seal the MEMS sensor in a vacuum.

主权项

1. A method of forming microelectromechanical systems (MEMS) devices comprising:
providing a carrier wafer having a carrier wafer first side and a carrier wafer second side; providing a control-circuit wafer having a control-circuit wafer first side and a control-circuit wafer second side, the control-circuit wafer including a plurality of integrated MEMS control circuits formed at the control-circuit wafer first side; bonding the carrier wafer first side to the control-circuit wafer first side with bonding agent applied at locations corresponding to die boundaries on the control-circuit wafer; providing a sensor wafer having a first side and second side, the sensor wafer including a plurality of MEMS sensors; bonding the sensor wafer first side to the control-circuit wafer second side; and sawing the carrier wafer through the bonding agent at the locations corresponding to the die boundaries to separate the carrier wafer from the control-circuit wafer.