发明名称 |
PROCESS FOR FORMING SILVER CONDUCTORS ON A SUBSTRATE |
摘要 |
<p>PROCESS FOR FORMING SILVER CONDUCTORS ON A SUBSTRATE The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink.</p> |
申请公布号 |
CA1249065(A) |
申请公布日期 |
1989.01.17 |
申请号 |
CA19870541395 |
申请日期 |
1987.07.06 |
申请人 |
NORTHERN TELECOM LIMITED |
发明人 |
DRAKE, ALLAN R.;FINN, ROGER C.;BENNETT, REGINALD B.P. |
分类号 |
G03F7/004;H05K1/09;H05K3/24;H05K3/34;(IPC1-7):H05K3/10 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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