Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauteils, insbesondere zur Herstellung einer Induktionsspule für Chipkarten

摘要

In the prior art, induction coils which can be integrated in chip cards are produced on the basis of a laminate system coated with a photosensitive resist, namely using a subtractive photolithographic etching method. The throughput rates attained with these prior art methods are low. The invention proposes a method that comprises the following steps 1 to 3: 1. providing a flexible laminate system which comprises insulating material and, on at least one surface, conductor material; 2. printing the conductor material surface with etching resist, namely using a silk-screen printing technique; and 3. etching the printed laminate system. The method steps are carried out in an at least partially continuous process. The invention also concerns a device for carrying out the method according to the invention, and a laminate system which can be used in particular with the method and device according to the invention.