发明名称 Method for etching a semiconductor method for fabricating semiconductor device method for fabricating semiconductor laser and semiconductor laser
摘要 A method of etching a III-V compound semiconductor uses an etching gas including the group V element of the III-V compound semiconductor substrate layer while keeping the III-V compound semiconductor layer at a temperature higher than the crystal growth temperature of the III-V compound semiconductor. Etching using this method provides a higher degree of controllability than wet etching. In addition, because no etching solution is employed, the etching method can be employed in a crystal growth apparatus. Further, because an element of the III-V compound semiconductor layer is employed in the etching gas, incorporation of residual impurities can be prevented, keeping the etched surface clean.
申请公布号 US5872022(A) 申请公布日期 1999.02.16
申请号 US19950522933 申请日期 1995.09.01
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 MOTODA, TAKASHI;KATO, MANABU;TAKEMI, MASAYOSHI
分类号 H01L21/302;H01L21/20;H01L21/306;H01S3/094;H01S5/00;H01S5/026;H01S5/12;H01S5/20;H01S5/223;H01S5/227;H01S5/343;H01S5/40;(IPC1-7):H01L21/00 主分类号 H01L21/302
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