| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayered wiring board which satisfies dielectric characteristics as a high-frequency circuit board and has no warpage or deformation. SOLUTION: This multilayered wiring board 1 is formed by arranging wiring patterns 2 and 3 made mainly of Ag or Cu among a plurality of dielectric layers. The dielectric layer is represented by a formula, (1-x)MgTiO3 .xCaTiO3 (x:0<=x<=0.2). If the dielectric material is assumed to have 100 pts.wt., a compound containing B has 3 to 20 pts.wt. in terms of B2 O3 , a compound containing alkaline metal has 1 to 10 pts.wt. in terms of alkaline metal carbonate, a compound containing Si has 0.01 to 5 pts.wt. in terms of SiO2 , and a compound containing alkaline earth metal has 0.1 to 2 pts.wt. in terms of alkaline earth metal.</p> |
