CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM

摘要

A conductive pattern forming film is provided for forming a conductive pattern on a flexible general plastic substrate by a simple process and for easily forming the conductive pattern by using an apparatus that performs a simple process of pressurization at a low temperature. A conductive pattern forming method and a conductive pattern forming apparatus for such film are also provided. The conductive pattern forming film is provided by arranging on the flexible film substrate a pattern which is formed by applying pressure while heating a conductive paste applied by diffusion of a powdery material or fine particles of a metal or a semiconductor. The conductive pattern forming apparatus is composed of a sample arranging table having a flat placing surface, and a pressurizing driving body movably arranged to the placing surface by facing the surface. The pressurizing driving body has a supporting base composed of a metal flat plate having a metal spherical body on the lower surface.