发明名称 |
Heat-Resistant Photosensitive Resin Composition, Method For Forming Pattern Using the Composition, and Electronic Part |
摘要 |
A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.
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申请公布号 |
US2008233513(A1) |
申请公布日期 |
2008.09.25 |
申请号 |
US20040594548 |
申请日期 |
2004.03.31 |
申请人 |
KOMATSU HIROSHI;FUJIEDA NAGATOSHI;NAKANO HAJIME |
发明人 |
KOMATSU HIROSHI;FUJIEDA NAGATOSHI;NAKANO HAJIME |
分类号 |
G03F7/004;C08G73/10;C08G73/22;G03F7/023;G03F7/037;G03F7/038;G03F7/26 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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