发明名称 ELECTROPLATING DEVICE AND METHOD
摘要 <p>The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.</p>
申请公布号 EP2010700(A2) 申请公布日期 2009.01.07
申请号 EP20070727869 申请日期 2007.04.05
申请人 BASF SE 发明人 LOCHTMAN, RENE;KACZUN, JUERGEN;SCHNEIDER, NORBERT;PFISTER, JUERGEN;POHL, GERT;WAGNER, NORBERT
分类号 C25D7/06;C25D7/00;C25D17/00 主分类号 C25D7/06
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