发明名称 |
Method and apparatus for stabilizing plating film impurities |
摘要 |
A method of stabilizing plating film impurities in an electrochemical plating bath solution is disclosed. The method includes providing an electrochemical plating machine in which an electrochemical plating process is carried out. A by-product bath solution is formed by continually removing a pre-filtered bath solution from the machine and removing an additive from the pre-filtered bath solution. A clean bath solution is formed by removing an additive by-product from the by-product bath solution. An additive bath solution is formed by adding a fresh additive to the clean bath solution. The additive bath solution is added to the electrochemical plating machine. An apparatus for stabilizing film impurities in an electrochemical plating bath solution is also disclosed.
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申请公布号 |
US7481910(B2) |
申请公布日期 |
2009.01.27 |
申请号 |
US20040880675 |
申请日期 |
2004.06.30 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
FENG HSIEN-PING;CHENG MING-YUANG;CHENG SI-KWUA;LIN STEVEN;TSAO JUNG-CHIH;FAN CHEN-PENG;LIU CHI-WEN |
分类号 |
C25D17/00;B01D29/56 |
主分类号 |
C25D17/00 |
代理机构 |
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主权项 |
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地址 |
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