Method for producing a micromechanical component, and micromechanical component

摘要

A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.

主权项

1. A method for producing a micromechanical component, the method comprising:
providing a substrate having a first outer surface and a second outer surface, which faces away from the first outer surface; forming a through-hole through the substrate from the first outer surface of the substrate up to the second outer surface of the substrate, such that a first opening of the through-hole is enclosed by the first outer surface of the substrate, and a second opening of the through-hole is enclosed by the second outer surface of the substrate; attaching an optical functional layer on the second outer surface of the substrate, wherein the optical functional layer covers the second opening of the through-hole; removing a first segment of the substrate that includes the first opening of the through-hole on the first outer surface of the substrate so that there arises a third outer surface that is inclined relative to the second outer surface of the substrate, the third outer surface facing away from the second outer surface of the substrate, the inclined third outer surface enclosing a third opening of the through-hole; and separating the micromechanical component by separating a first part of the substrate, which includes the through-hole, from a remaining part of the substrate, and separating a second part of the optical functional layer, which is attached to the first part, from a remaining part of the optical functional layer.