| 摘要 |
<p>Epoxy resin compositions comprising (A) an epoxy resin, (C) an inorganic filler, (D) a cure accelerator in the form of an addition product of tertiary phosphine and benzoquinone, (E) a maleimide compound, and (F) an alkenyl phenol are effectively moldable and cures into products having a high Tg and a low dielectric constant and are best suited for the encapsulation of semiconductor devices.</p> |
