常温接合装置および常温接合方法

摘要

PROBLEM TO BE SOLVED: To improve bonding reliability when bonding a plurality of substrates together.SOLUTION: A normal-temperature bonding apparatus includes: an activation device 16 which emits activation beams Ba and Bb with which a first surface 50 of a first substrate 52 and a second surface 40 of a second substrate 42 are irradiated; and a press-contact mechanism 15 which bonds the first substrate 52 and the second substrate 42 together by bringing the first surface 50 and the second surface 40 into contact with each other after the first surface 50 and the second surface 40 are irradiated with the activation beams Ba and Bb. The activation beams Ba and Bb contain neon atoms.