Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate

摘要

A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main body includes a plurality of insulator layers laminated on each other. The wiring lines each include via conductors separately provided in the plurality of insulator layers. In at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer.

主权项

1. A multilayer wiring substrate comprising:
a substrate main body including a first main surface and a second main surface; and a plurality of wiring lines provided in the substrate main body, the plurality of wiring lines extending from the first main surface toward the second main surface side; wherein the substrate main body includes a plurality of insulator layers laminated on top of one another; the plurality of wiring lines each include via conductors separately provided in the plurality of insulator layers; in at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer; and a distance between adjacent ones of the plurality of wiring lines continuously increases from the first main surface side toward the second main surface side.