ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM

摘要

The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burden on the environment. Specifically, the present invention provides an electrically conductive adhesive film that contains metal particles, a thermosetting resin and a compound having Lewis acid properties or a heat acid generator, wherein the compound having Lewis acid properties or the heat acid generator is characterized by being selected from among boron fluoride or a complex thereof, a protic acid having a pKa value of -0.4 or lower, or a salt or acid obtained by combining the same anion as the salt of the protic acid with a hydrogen ion or other cation. In addition, the present invention provides a dicing and die bonding film obtained by bonding the electrically conductive adhesive film to a pressure-sensitive adhesive tape.